IGBT/MOSFET Modules、Thermoelectric Cooling Modules、Power Control Circuit、Power Hybrid Circuit

Propulsion Systems


Propulsion systems require high power,large currency and high voltage capabilities. As the propulsion system may operate under extreme environmental conditions such as high temperatures or strong vibrations, optimizing the distribution system is necessary. Operational continuity plays an essential role in the efficacy of propulsion engines and electric power systems. Even minor defects, system shutdowns, or failures can have a profound impact on traction systems leading to high financial losses. Hence, ensuring the highest quality standards and enhanced reliability during system development is of paramount importance. Ceramic substrates enable higher currents while addressing the heat removal process. This feature significantly enhances the overall performance of the system.

Power Transistors


The adoption of transistor devices is being driven by the increasing demand for smaller and more efficient power conversion products. The latest trend for these devices is to focus on efficiency, particularly in terms of higher voltages in smaller sizes. However, as the size of these devices gets smaller, there are challenges in managing heat, space, and reliability. Ceramic substrates are being used to cool components and provide interconnections at the semiconductor level.

Electric Motors


In power electronic devices, power substrates play a role in connecting and cooling components in IGBT and MOSFET power modules. In motor drives, the design of ceramic substrates focuses on carrying larger currents, achieving higher voltage isolation, and being able to operate over a wider temperature range. Due to their high thermal conductivity, large thermal capacity, and good heat dissipation, ceramic substrates have become an indispensable component in power electronic devices for critical tasks such as control systems. Compared to metal or plastic substrates, the coefficient of thermal expansion (CTE) of ceramic substrates is closer to that of silicon, so silicon chips directly mounted on the substrate (chip-on-board packaging) experience lower mechanical stress.